I am working on a project where we need to provide RF Shielding and are looking for how to adhere a copper sheet below an epoxy floor. The manufacturer recommends a bonding agent that is "
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Seema Pandya
Sustainability ConsultantSLP
151 thumbs up
November 2, 2011 - 5:43 pm
Hi Jonathan,
Oddly enough, your project situation came to my desk via one of your project members moments ago. I would like to refer to David Posada's answer to another question a few comments down as it relates to your question.
David wrote, "Since it's often unclear what category a particular product should fall under, it maybe necessary to check the definitions in Rule 1168 to help guide your decision. There it states "SPECIAL PURPOSE CONTACT ADHESIVE is a contact adhesive that is used to bond melamine covered board, metal, unsupported vinyl, Teflon, ultra-high molecular weight polyethylene, rubber and wood veneer 1/16 inch or less in thickness to any porous or nonporous surface."
This would suggest it's intended more for laminating sheets of thin material to a substrate. "Contact Adhesive" is more specifically defined as adhesive that is allowed to dry on both before bringing the materials together."
The application you are using seems to fall under the Special Purpose Contact Adhesives as adhering metal to a porous surface. I suggest you use the 250 g/l limit and call out the application in the your LEED documentation product description as being an adhesive for metal to porous material purposes and only do the VOC budget if you feel it is necessary once you receive comments back from your reviewers.