The local lumberyard has particle board with this stamp on it: EPP-CPA 3-08.
Here is a bit about it, on PDF: http://www.pbmdf.com/CPA30/files/ccLibraryFiles/Filename/000000001428/EP...
In it it says:
Unfinished Particleboard. Formaldehyde emissions from unfinished particleboard must be less than or equal to 0.18 ppm using the Large Chamber Test Method (ASTM E1333). Particleboard products will be evaluated at the typical loading rate for particleboard of 0.13 ft2/ft3. Particleboard that uses a bonding system other than Urea Formaldehyde, may qualify for “Exempted” status under section 6.3 of the EPP Grademark Manual. One exception to this requirement is for Grade LD of ANSI A208.1-1999 (Door Core) products. Grade LD is allowed a loading ratio of 0.04 ft2/ft3 as per section 3.4 of ANSI A208.1-1999.
I'm thinking this doesn't qualify, it just has limits for the UF,..anyone have anymore info on this?
Josh Jacobs
Technical Information & Public Affairs ManagerUL Environment
515 thumbs up
January 26, 2011 - 1:13 pm
Because the requirement for the credit states that there is no added urea-formaldehyde, the emission of formaldehyde from the particleboard doesn't really matter. The problem with the stamp is that the way that I read the standard, it does not preclude products from having added urea-formaldehyde. Therefore I do not believe that the stamp would help qualify the product for this credit - now if the supplier or manufacturer of the particleboard has a letter stating that none was added, that is normally enough for proof of compliance.
Thankfully in the proposed update to EQc4 they focus on actual product emissions - even in particle board - not just product content.