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Adhesive used in the project to bond laminate to wood substrate
CI-2009 IEQc4.4:Low-Emitting Materials—Composite Wood and Agrifiber Productsposted by Marie Kranjack on
We just had this credit denied in our Design and Construction Final Review.
ULEF/CARB meeting credit criteria?
CI-2009 IEQc4.4:Low-Emitting Materials—Composite Wood and Agrifiber Productsposted by William Weaver on
We just received preliminary review comments on a project and this credit was marked pending as a result of one MDF product that uses a ULEF resin process.
Laminating Adhesives
CI-2009 IEQc4.4:Low-Emitting Materials—Composite Wood and Agrifiber Productsposted by Joseph Greene on
Hoping for some collective wisdom. Construction Preliminary Review comments requested specific information on laminating adhesives for products listed in this credit.
EPP particle board
CI-2009 IEQc4.4:Low-Emitting Materials—Composite Wood and Agrifiber Productsposted by Parker Williams on
The local lumberyard has particle board with this stamp on it: EPP-CPA 3-08. Here is a bit about it, on PDF: http://www.pbmdf.com/CPA30/files/ccLibraryFiles/Filename/000000001428/EPP%20CPA%203-08%2
Any change on accepting CARB phase II ?
CI-2009 IEQc4.4:Low-Emitting Materials—Composite Wood and Agrifiber Productsposted by Susan Di Giulio on
I have been having an ongoing back and forth with a bamboo plywood and flooring distributor about a few products that they import form China.
Skateboard Wall Panels
CI-2009 IEQc4.4:Low-Emitting Materials—Composite Wood and Agrifiber Productsposted by Holly Nichols on
I am hoping to use a product that uses bamboo end cuts from the waste stream of another manufacturing process as wood wall panels.
Division 12 included
CI-2009 IEQc4.4:Low-Emitting Materials—Composite Wood and Agrifiber Productsposted by Jennifer Berthelot-Jelovic on
I don't have my LEED Reference Guide with me. I am working on a Lab. There is millwork included in Division 12 for the Casework.